Patent Assignment
Reel/Frame 017809/0593
Assignment of Assignor's Interest
Recorded: 2006-04-24
Pages: 3
Assignors
BRILLHART, PAUL LUKAS
Executed: 2006-04-10
FOVELL, RICHARD
Executed: 2006-04-13
BUCHBERGER, DOUGLAS A., JR.
Executed: 2006-04-10
BURNS, DOUGLAS H.
Executed: 2006-04-20
BERA, KALLOL
Executed: 2006-04-10
HOFFMAN, DANIEL J.
Executed: 2006-04-24
Assignee
APPLIED MATERIALS, INC.
P.O. BOX 450A, LEGAL AFFAIRS DEPT., M/S 2061-LEGAL, SANTA CLARA, CALIFORNIA, 95052
Covered Property
(1)
Method of Cooling a Wafer Support at a Uniform Temperature in a Capacitively Coupled Plasma Reactor
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 13, 2010
From: APPLIED MATERIALS, INC.
To: ADVANCED THERMAL SCIENCES CORPORATION
Reel/Frame 024834/0937 →
Corrective Assignment to Correct the Assignee Name Previously Recorded on Reel 024834 Frame 0937. Assignor(S) Hereby Confirms the Advanced Thermal Sciences Corporation.
Aug 17, 2010
From: APPLIED MATERIALS, INC.
To: ADVANCED THERMAL SCIENCES CORPORATION
Reel/Frame 024849/0577 →
Assignment of Assignor's Interest
Mar 21, 2012
From: ADVANCED THERMAL SCIENCES CORPORATION
To: BE AEROSPACE, INC.
Reel/Frame 027900/0509 →
Security Interest
Mar 10, 2015
From: B/E AEROSPACE, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 035176/0493 →
Release of Security Interest
Jan 25, 2019
From: JP MORGAN CHASE BANK, N.A
To: B/E AEROSPACE, INC.
Reel/Frame 049209/0619 →