Patent Assignment
Reel/Frame 017811/0530
Assignment of Assignor's Interest
Recorded: 2006-04-25
Pages: 3
Assignor
HITACHI ULSI SYSTEMS CO., LTD.
Executed: 2006-04-19
Assignee
RENESAS TECHNOLOGY CORP.
4-1, MARUNOUCHI 2-CHOME, CHIYODA-KU, PATENT ADMINISTRATION GROUP INTELLECTUAL PROPERTY DIVISION, TOKYO, JAPAN
Covered Properties
(3)
Semiconductor Integrated Circuit Device Including Dummy Patterns Located to Reduce Dishing
Patent:
6,603,162 →
Application:
09/692,450 →
Semiconductor Integrated Circuit Device Including Dummy Patterns Located to Reduce Dishing
Semiconductor Integrated Circuit Device Including Dummy Patterns Located to Reduce Dishing
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 20, 2000
From: UCHIYAMA, HIROYUKI; CHAKIHARA, HIRAKU; ICHISE, TERUHISA; KAMINAGA, MICHIMOTO
To: HITACHI ULSI SYSTEM CO., LTD.; HITACHI, LTD.
Reel/Frame 011264/0577 →
Assignment of Assignor's Interest
Sep 26, 2003
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 014570/0380 →
Assignment of Assignor's Interest
Apr 18, 2004
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 015257/0286 →
Merger
Jul 30, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025204/0512 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →