Patent Assignment
Reel/Frame 015257/0286
Assignment of Assignor's Interest
Recorded: 2004-04-18
Pages: 4
Assignor
HITACHI, LTD.
Executed: 2004-03-31
Assignee
RENESAS TECHNOLOGY CORP.
4-1, MARUNOUNCHI 2-CHOME CHIYODA-KU, TOKYO, JAPAN
Covered Properties
(7)
Semiconductor Integrated Circuit Device Including Misfets Each with a Gate Electrode Extended Over a Boundary Region Between an Active Region and an Element Isolation Trench
Semiconductor device including stress inducing films formed over N-channel and P-channel field effect transistors and a method of manufacturing the same
Semiconductor Integrated Circuit Device Including Dummy Patterns Located to Reduce Dishing
Semiconductor device and method of fabricating the same
Application:
10/455,441 →
Publication:
US 2003/0227062
Semiconductor Memory Device and a Method of Manufacturing the Same, a Method of Manufacturing a Vertical Misfet and a Vertical Misfet, and a Method of Manufacturing a Semiconductor Device and a Semiconductor Device
Semiconductor Integrated Circuit Device
Semiconductor Integrated Circuit Device
Related Assignments
(12)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 6, 2003
From: HORIUCHI, MASATADA; OHNISHI, KAZUHIRO; SHIMA, AKIO; TAKAHAMA, TAKASHI
To: HITACHI, LTD.; HITACHI ULSI SYSTEMS CO., LTD.
Reel/Frame 014151/0614 →
Assignment of Assignor's Interest
Jul 30, 2003
From: CHAKIHARA, HIRAKU; OKUYAMA, KOUSUKE; MONIWA, MASAHIRO; MIZUNO, MAKOTO
To: HITACHI, LTD.; HITACHI ULSI SYSTEMS CO., LTD.
Reel/Frame 014359/0791 →
Assignment of Assignor's Interest
Sep 13, 2003
From: SHIMIZU, AKIHIRO; OOKI, NAGATOSHI; NONAKA, YUSUKE; ICHINOSE, KATSUHIKO
To: HITACHI, LTD.; HITACHI ULSI LYSTEMS CO. LTD.
Reel/Frame 014512/0898 →
Assignment of Assignor's Interest
Apr 25, 2006
From: HITACHI ULSI SYSTEMS CO., LTD.
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 017811/0530 →
Assignment of Assignor's Interest
Sep 29, 2006
From: HITACHI, LTD.; HITACHI ULSI SYSTEMS CO.
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 018337/0382 →
Merger
Jul 30, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025204/0512 →
Assignment of Assignor's Interest
May 9, 2014
From: HITACHI ULSI SYSTEMS CO., LTD.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 032859/0252 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →
Patent Security Agreement
Jun 5, 2020
From: ACACIA RESEARCH GROUP LLC; AMERICAN VEHICULAR SCIENCES LLC; BONUTTI SKELETAL INNOVATIONS LLC; CELLULAR COMMUNICATIONS EQUIPMENT LLC
To: STARBOARD VALUE INTERMEDIATE FUND LP, AS COLLATERAL AGENT
Reel/Frame 052853/0153 →
Release of Security Interest in Patents
Jul 8, 2020
From: STARBOARD VALUE INTERMEDIATE FUND LP
To: ACACIA RESEARCH GROUP LLC; AMERICAN VEHICULAR SCIENCES LLC; BONUTTI SKELETAL INNOVATIONS LLC; CELLULAR COMMUNICATIONS EQUIPMENT LLC
Reel/Frame 053654/0254 →
Corrective Assignment to Correct the Assignor Name Previously Recorded on Reel 052853 Frame 0153. Assignor(S) Hereby Confirms the Patent Security Agreement.
Mar 2, 2021
From: ACACIA RESEARCH GROUP LLC
To: STARBOARD VALUE INTERMEDIATE FUND LP, AS COLLATERAL AGENT
Reel/Frame 056775/0066 →
Corrective Assignment to Correct the Assignee Name Previously Recorded at Reel: 053654 Frame: 0254. Assignor(S) Hereby Confirms the Assignment.
Jun 10, 2021
From: STARBOARD VALUE INTERMEDIATE FUND LP
To: ACACIA RESEARCH GROUP LLC
Reel/Frame 057454/0045 →