IP Library › Assignment 017814/0356
Patent Assignment
Reel/Frame 017814/0356

Assignment of Assignor's Interest

Recorded: 2006-06-20 Pages: 4
Assignors
MITARAI, SHUN
Executed: 2006-06-06
IKEDA, KOICHI
Executed: 2006-06-06
TADA, MASAHIRO
Executed: 2006-06-06
AKIBA, AKIRA
Executed: 2006-06-06
MORITA, SHINYA
Executed: 2006-06-06
Assignee
SONY CORPORATION
7-35 KITASHINAGAWA, SHINAGAWA-KU, TOKYO, JAPAN
Covered Property (1)
Semiconductor Composite Device and Method of Manufacturing the Same
Patent: 7,566,956 →
Application: 11/425,077 →
Publication: US 2006/0289955
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 19, 2016
From: SONY CORPORATION
To: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Reel/Frame 040419/0001 →