Semiconductor composite device and method of manufacturing the same
View Patent ↗The present invention provides a semiconductor composite device including a semiconductor device formed on or in a substrate, an insulating film formed on the substrate so as to cover the semiconductor device, a micro electro mechanical portion formed on the insulating film, and a wiring layer connected to the semiconductor device and the micro electro mechanical portion.
1. A semiconductor composite device comprising:
a substrate;
semiconductor device formed on or in said substrate;
an insulating film formed on said substrate so as to cover said semiconductor device;
a micro electro mechanical portion formed on said insulating film and configured to accept thereon a micro electro mechanical device; and
a wiring layer with wiring connected to said semiconductor device and said micro electro mechanical portion,
wherein,
said wiring layer includes another insulating film, and wiring formed on said another insulating film,
said another insulating film does not cover said micro electro mechanical portion, and
said micro electro mechanical portion is exposed.
2. A semiconductor composite device comprising:
semiconductor device formed on or in a substrate;
micro electro mechanical portion formed on said substrate; and
wiring layer for connection with said semiconductor device and said micro electro mechanical portion; wherein
aid micro electro mechanical portion is enveloped with a protective film, with an air layer therebetween; and
aid semiconductor electronic circuit and said micro electro mechanical portion are covered with an insulating film.