Patent Assignment
Reel/Frame 017817/0068
Assignment of Assignor's Interest
Recorded: 2006-04-25
Pages: 2
Assignors
LEE, WEN-HAO
Executed: 2005-10-14
WANG, YU-PO
Executed: 2005-10-14
HSIAO, CHENG-HSU
Executed: 2005-10-14
Assignee
SILICONWARE PRECISION INDUSTRIES CO., LTD.
NO. 123, SEC. 3, DA FONG ROAD, TANTZU, TAICHUNG, ROC, TAIWAN
Covered Property
(1)
Semiconductor Package and Substrate Structure Thereof