Patent Assignment
Reel/Frame 017817/0125
Assignment of Assignor's Interest
Recorded: 2006-04-25
Pages: 2
Assignors
MIYATA, KENSYO
Executed: 2006-04-18
HARADA, SEIJI
Executed: 2006-04-18
NAGASAWA, KEIICHI
Executed: 2006-04-18
Assignees
NIPPEI TOYAMA CORPORATION
26-2, MINAMI-OHI 6-CHOME, SHINAGAWA-KU, TOKYO, JAPAN
DISCO CORPORATION
13-11, OMORI-KITA 2-CHOME, OTA-KU, TOKYO 143-8580, JAPAN
Covered Property
(1)
Manufacturing method for semiconductor wafers, slicing method for slicing work and wire saw used for the same
Application:
11/410,035 →
Publication:
US 2006/0258268
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Dec 24, 2008
From: NIPPEI TOYAMA CORPORATION
To: KOMATSU NTC LID.
Reel/Frame 022028/0053 →
Corrective Assignment to Correct the Assignee's Name from "Komatsu Ntc Lid." to "Komatsu Ntc Ltd." Previously Recorded on Reel 022028 Frame 0053. Assignor(S) Hereby Confirms the Change of Name.
Nov 2, 2010
From: NIPPEI TOYAMA CORPORATION
To: KOMATSU NTC LTD.
Reel/Frame 025232/0400 →