IP Library › Assignment 017832/0066
Patent Assignment
Reel/Frame 017832/0066

Assignment of Assignor's Interest

Recorded: 2006-04-21 Pages: 2
Assignors
SHIN, SU-HO
Executed: 2006-04-14
KWEON, SOON-CHEOL
Executed: 2006-04-14
SHIN, KYU-HO
Executed: 2006-04-14
KWON, KI-HWAN
Executed: 2006-04-14
CHOI, SEUNG-TAE
Executed: 2006-04-14
MOON, CHANG-YOUL
Executed: 2006-04-14
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Led Package Structure and Manufacturing Method, and Led Array Module
Patent: 7,821,027 →
Application: 11/408,101 →
Publication: US 2007/0023893
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 8, 2010
From: SAMSUNG ELECTRONICS CO., LTD.
To: SAMSUNG LED CO., LTD.
Reel/Frame 024205/0828 →
Merger Aug 7, 2012
From: SAMSUNG LED CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 028744/0272 →