IP Library › Assignment 024205/0828
Patent Assignment
Reel/Frame 024205/0828

Assignment of Assignor's Interest

Recorded: 2010-04-08 Pages: 3
Assignor
SAMSUNG ELECTRONICS CO., LTD.
Executed: 2010-03-30
Assignee
SAMSUNG LED CO., LTD.
314, MAETAN 3-DONG, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, KOREA, REPUBLIC OF
Covered Properties (2)
Led Package Structure and Manufacturing Method, and Led Array Module
Patent: 7,821,027 →
Application: 11/408,101 →
Publication: US 2007/0023893
Led Array Module
Patent: 8,002,443 →
Application: 11/473,188 →
Publication: US 2007/0001582
Related Assignments (3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 21, 2006
From: SHIN, SU-HO; KWEON, SOON-CHEOL; SHIN, KYU-HO; KWON, KI-HWAN
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 017832/0066 →
Assignment of Assignor's Interest Jun 23, 2006
From: SHIN, SU-HO; MOON, CHANG-YOUL; SHIN, KYU-HO; KWEON, SOON-CHEOL
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 018029/0523 →
Merger Aug 7, 2012
From: SAMSUNG LED CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 028744/0272 →