Patent Assignment
Reel/Frame 017836/0526
Assignment of Assignor's Interest
Recorded: 2006-05-02
Pages: 3
Assignee
FILTRONIC COMPOUND SEMICONDUCTOR LIMITED
HEIGHINGTON LANE BUSINESS PARK, NEWTON AYCLIFFE, COUNTY DURHAM, DL5 6JW, UNITED KINGDOM
Covered Property
(1)
Method of bonding a semiconductor wafer to a support substrate
Application:
11/349,566 →
Publication:
US 2007/0184630
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrected Cover Sheet to Correct Assignee's Name, Previously Recorded at Reel/Frame 017836/0526 (Assignment of Assignor's Interest)
Jul 18, 2006
From: CULLEN, JOHN MELVYN; COMBE, SUZANNE
To: FILTRONIC COMPOUND SEMICONDUCTORS LIMITED
Reel/Frame 018114/0575 →
Change of Name
Apr 16, 2009
From: FILTRONIC COMPOUND SEMICONDUCTORS LIMITED
To: RFMD (UK) LIMITED
Reel/Frame 022552/0462 →