IP Library Assignment 017842/0739
Patent Assignment
Reel/Frame 017842/0739

Assignment of Assignor's Interest

Recorded: 2006-05-08 Pages: 2
Assignors
MIYAHARA, TOSHIMICHI
Executed: 2006-04-08
TO, YUU
Executed: 2006-04-12
KAWAMOTO, YOU
Executed: 2006-04-17
Assignee
KABUSHIKI KAISHA SHINKAWA
2-51-1, INADAIRA, MUSASHIMURAYAMA-SHI, TOKYO, JAPAN
Covered Property (1)
Bonding Apparatus
Patent: 7,842,897 →
Application: 11/317,276 →
Publication: US 2006/0186839
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Dec 4, 2025
From: SHINKAWA LTD.
To: YAMAHA ROBOTICS CO., LTD.
Reel/Frame 073833/0572 →