Patent Assignment
Reel/Frame 073833/0572
Merger
Recorded: 2025-12-04
Pages: 21
Assignor
SHINKAWA LTD.
Executed: 2025-07-01
Assignee
YAMAHA ROBOTICS CO., LTD.
21ST FLOOR, NEW PIER TAKESHIBA SOUTH TOWER 1-16-1 KAIGAN, MINATO-KU, TOKYO, 105-0022, JAPAN
Covered Properties
(113)
Bonding Apparatus
Ultrasonic Horn
Wire Bonding Apparatus, Record Medium Storing Bonding Control Program, and Bonding Method
Bonding Apparatus, Ball Forming Device in Said Bonding Apparatus, and Ball Forming Method Using Said Bonding Apparatus
Wire Bonding Apparatus
Bonding Apparatus and Method for Cleaning Tip of a Bonding Tool
Semiconductor Device and Wire Bonding Method
Horn Attachment Arm
Apparatus for Detecting Press-Bonded Ball at Bonding Portion in Bonding Apparatus and Method for Detecting Press-Bonded Ball at Bonding Portion
Wire Bonding Method and Semiconductor Device
Wire Bonding Method and Semiconductor Device
Wire Bonding Apparatus, Record Medium Storing Bonding Control Program, and Bonding Method
Die Pickup Apparatus for Picking Up Semiconductor Dies and Methods for Picking Up Semiconductor Dies
Semiconductor Device and Wire Bonding Method
Method of Manufacturing Semiconductor Device
Bonding Apparatus and Bonding Stage Height Adjustment Method for the Bonding Apparatus
Pressure-Bonded Ball Diameter Detecting Apparatus and Pressure-Bonded Ball Diameter Detecting Method
Bonding Apparatus
Method of Manufacturing Semiconductor Device and Wire Bonding Apparatus
Bonding Method, Bonding Apparatus, and Manufacturing Method of Semiconductor Device Unsing the Same
Metal Nanoink and Process for Producing the Metal Nanoink, and Die Bonding Method and Die Bonding Apparatus Using the Metal Nanoink
Wire Bonding Apparatus and Wire Bonding Method
Method of Manufacturing Semiconductor Device, and Bonding Apparatus
Ultrasonic Horn
Ultrasonic Horn
Ultrasonic Horn
Method of Manufacturing Semiconductor Device and Wire Bonding Apparatus
Wire Bonding Method and Semiconductor Device
Plasma Ignition System, Plasma Ignition Method, and Plasma Generating Apparatus
Pattern Position Detecting Method
Electronic Component Mounting Apparatus and the Same Method Thereof
Plasma Apparatus and Method for Producing the Same
Bonding Apparatus
Heater for Bonding Apparatus and Method of Cooling the Same
Wire-Bonding Apparatus and Method of Wire Bonding
Wire-Bonding Apparatus and Method of Manufacturing Semiconductor Device
Bonding Tool Cooling Apparatus and Method for Cooling Bonding Tool
Flip Chip Bonder and Method of Correcting Flatness and Deformation Amount of Bonding Stage
Flip Chip Bonder and Flip Chip Bonding Method
Electronic Component Mounting Apparatus and Method
Method of Manufacturing Semiconductor Device
Electronic-Component Mounting Apparatus
Bonding Stage and Method of Manufacturing the Same
Mounting Apparatus and Method of Correcting Offset Amount of the Same
Method of Manufacturing Semiconductor Device and Wire Bonding Apparatus
Wire Bonding Apparatus and Method of Manufacturing Semiconductor Device
Ball Forming Device, Wire-Bonding Apparatus, and Ball Formation Method
Discharge Examination Device, Wire-Bonding Apparatus, and Discharge Examination Method
Method for Producing Semiconductor Device, and Wire-Bonding Apparatus
Semiconductor Device Manufacturing Method, Semiconductor Device, and Wire Bonding Apparatus
Wire Tensioner
Bonding Apparatus and Bonding Method
Bonding Device
Bonding Apparatus and Method of Estimating Position of Landing Point of Bonding Tool
Mounting Apparatus
Mounting Apparatus and Measuring Method
Electronic Component Mounting Apparatus
Flux Reservoir Apparatus
Mounting Apparatus
Mounting Apparatus
Electronic-Component Mounting Apparatus
Wire Bonding Apparatus and Wire Bonding Method
Manufacturing Method of Semiconductor Device
Ultrasonic Horn
Electronic Component Handling Unit
Electronic Component Mounting Apparatus
Bonding apparatus including a heater and a cooling flow path used for stacking a plurality of semiconductor chips
Wire Bonding Apparatus, Circuit for Wire Bonding Apparatus, and Method for Manufacturing Semiconductor Device
Method for Calibrating Wire Clamp Device
Wire Bonding Method and Wire Bonding Apparatus
Wire Clamp Apparatus Calibration Method and Wire Bonding Apparatus
Method of Manufacturing Semiconductor Device, and Mounting Device
Method for Manufacturing Semiconductor Device, and Mounting Apparatus
Semiconductor Chip Mounting Device and Method for Manufacturing Semiconductor Device
Bonding Apparatus and Method for Detecting Height of Bonding Target
Mounting Head
Semiconductor-Device Manufacturing Method and Manufacturing Apparatus
Mounting Apparatus and Mounting System
Electronic Component Mounting Device
Pick-Up Device and Pick-Up Method
Bonding Apparatus and Bonding Method
Method for Producing Structure, and Structure
Wire Bonding Apparatus and Manufacturing Method for Semiconductor Apparatus
Wiring Structure with Movement Mechanism
Bonding Apparatus
Apparatus for Manufacturing Semiconductor Device
Mounting Apparatus and Method for Manufacturing Semiconductor Device
Bonding Apparatus and Bonding Method
Device and Method for Positioning First Object in Relation to Second Object
Apparatus and Method for Linearly Moving Movable Body Relative to Object
Frame Feeder
Mounting Apparatus and Temperature Measurement Method
Device and Method for Linearly Moving First and Second Moving Bodies Relative to Target Object
Method for Setting Conditions for Heating Semiconductor Chip During Bonding, Method for Measuring Viscosity of Non-Conductive Film, and Bonding Apparatus
Mounting Device
Bonding Apparatus
Mounting Apparatus
Bonding Condition Evaluation Apparatus
Wire Shape Inspecting Apparatus and Wire Shape Inspecting Method
Wire Bonding Apparatus
Mounting Apparatus
Mounting Apparatus
Capillary Guide Device and Wire Bonding Apparatus
Wire Bonding Apparatus
Wire Bonding Apparatus and Method for Manufacturing Semiconductor Device
Bonding Apparatus and Bonding Method
Ultrasound Horn
Bonding Apparatus
Wire Bonding Apparatus, Method for Measuring Opening Amount of Clamp Apparatus, and Method for Calibrating Clamp Apparatus
Mounting Apparatus and Parallelism Detection Method in Mounting Apparatus
Wire Bonding Device, Wire Cutting Method and Non-Transitory Computer-Readable Recording Medium Recording Program
Wire Bonding Apparatus
Bonding Apparatus and Alignment Method
Related Assignments
(17)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
May 8, 2006
From: MIYAHARA, TOSHIMICHI; TO, YUU; KAWAMOTO, YOU
To: KABUSHIKI KAISHA SHINKAWA
Reel/Frame 017842/0739 →
Assignment of Assignor's Interest
Oct 6, 2006
From: KAKUTANI, OSAMU; KONDO, YUTAKA; SEYAMA, KOHEI
To: KABUSHIKI KAISHA SHINKAWA
Reel/Frame 018397/0043 →
Assignment of Assignor's Interest
Apr 19, 2007
From: TAKAHASHI, KUNIYUKI; TEI, SHINSUKE; SUZUKI, NORIKO; MORI, NORIKO
To: KABUSHIKI KAISHA SHINKAWA
Reel/Frame 019218/0946 →
Assignment of Assignor's Interest
Jul 13, 2007
From: SEYAMA, KOHEI
To: KABUSHIKI KAISHA SHINKAWA
Reel/Frame 019592/0024 →
Assignment of Assignor's Interest
Oct 1, 2007
From: NISHIURA, SHINICHI; MIYAMO, FUMIO; HORINO, MASAYUKI
To: KABUSHIKI KAISHA SHINKAWA
Reel/Frame 019951/0467 →
Assignment of Assignor's Interest
Oct 11, 2007
From: FUJITA, KAZUO
To: KABUSHIKI KAISHA SHINKAWA
Reel/Frame 019977/0865 →
Assignment of Assignor's Interest
Feb 14, 2008
From: MII, TATSUNARI; TOYAMA, TOSHIHIKO; YOSHINO, HIROAKI
To: KABUSHIKI KAISHA SHINKAWA
Reel/Frame 020558/0787 →
Assignment of Assignor's Interest
Feb 26, 2008
From: SEYAMA, KOHEI
To: KABUSHIKI KAISHA SHINKAWA
Reel/Frame 020612/0483 →
Assignment of Assignor's Interest
Jun 19, 2008
From: SUGAWARA, KENJI; CHEN, YONG
To: KABUSHIKI KAISHA SHINKAWA
Reel/Frame 021141/0095 →
Assignment of Assignor's Interest
Jan 23, 2009
From: OLDHAM, JOSHUA ROBERT
To: WHITE, ELIZABETH A.
Reel/Frame 022150/0719 →
Assignment of Assignor's Interest
Feb 25, 2010
From: MII, TATSUNARI; TEI, SHINSUKE; KIUCHI, HAYATO
To: KABUSHIKI KAISHA SHINKAWA
Reel/Frame 024010/0768 →
Assignment of Assignor's Interest
Mar 1, 2010
From: MII, TATSUNARI; TEI, SHINSUKE; KIUCHI, HAYATO
To: KABUSHIKI KAISHA SHINKAWA
Reel/Frame 024018/0736 →
Assignment of Assignor's Interest
Apr 12, 2010
From: MII, TATSUNARI; KIUCHI, HAYATO
To: SHINKAWA LTD.
Reel/Frame 024217/0040 →
Assignment of Assignor's Interest
Apr 27, 2010
From: UMEHARA, OKITO; TAKAHASHI, KUNIYUKI
To: SHINKAWA LTD.
Reel/Frame 024295/0846 →
Assignment of Assignor's Interest
Aug 2, 2010
From: SEYAMA, KOHEI; KONDO, YUTAKA; KAKUTANI, OSAMU; HAYATA, SHIGERU
To: SHINKAWA LTD.
Reel/Frame 024772/0472 →
Assignment of Assignor's Interest
Dec 14, 2010
From: SUGAWARA, KENJI; CHEN, YONG
To: SHINKAWA LTD
Reel/Frame 025500/0388 →
Corrective Assignment to Correct the 2ND and 3RD Inventors Doc Date Previously Recorded on Reel 024018 Frame 0736. Assignor(S) Hereby Confirms the (See Document for Details).
Dec 13, 2011
From: MII, TATSUNARI; TEI, SHINSUKE; KIUCHI, HAYATO
To: KABUSHIKI KAISHA SHINKAWA
Reel/Frame 027372/0925 →