IP Library Assignment 019977/0865
Patent Assignment
Reel/Frame 019977/0865

Assignment of Assignor's Interest

Recorded: 2007-10-11 Pages: 2
Assignor
FUJITA, KAZUO
Executed: 2007-08-21
Assignee
KABUSHIKI KAISHA SHINKAWA
2-51-1, INADAIRA, MUSASHIMURAYAMA-SHI, TOKYO, JAPAN
Covered Property (1)
Bonding Apparatus and Method for Cleaning Tip of a Bonding Tool
Patent: 7,893,383 →
Application: 11/879,086 →
Publication: US 2008/0023028
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Dec 4, 2025
From: SHINKAWA LTD.
To: YAMAHA ROBOTICS CO., LTD.
Reel/Frame 073833/0572 →