IP Library Granted Patent US 12,087,725
Granted Patent B2
US 12,087,725 · App. 17/603,584 · Granted Sep 10, 2024

Wire bonding apparatus, method for measuring opening amount of clamp apparatus, and method for calibrating clamp apparatus

Inventor: Toshihiko Toyama (Tokyo, JP)
Assignee: SHINKAWA LTD.
H01L24/78B23K20/004B23K20/005H01L2224/78001H01L2224/78353H01L2224/78621
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Quick Facts
Patent No.
US 12,087,725
App. No.
17/603,584
Granted
Sep 10, 2024
Kind
B2
Abstract

A wire bonding apparatus of an aspect includes: a clamp apparatus, having a pair of arms; a stage, moving the clamp apparatus in a horizontal direction; a rod member; a contact detection part, detecting contact between the rod member and the clamp apparatus; and a control apparatus, controlling opening and closing of the pair of arms and an operation of the stage and acquiring position information of the clamp apparatus. The control apparatus obtains an opening amount of the pair of arms based on position information of the clamp apparatus at a time when an outer side surface of a first arm contacts the rod member in a state where the pair of arms are closed and position information of the clamp apparatus at the time when the outer side surface of the first arm contacts the rod member in a state where the pair of arms are open.

Claims (25)

1. A wire bonding apparatus, comprising:

a clamp apparatus, having a pair of arms;

a stage, moving the clamp apparatus in a horizontal direction;

a rod member;

a contact detection part, detecting contact between the rod member and the clamp apparatus; and

a control apparatus, controlling opening and closing of the pair of arms and an operation of the stage and acquiring position information of the clamp apparatus, wherein:

the control apparatus executes a first control to make an outer side surface of a first arm of the pair of arms contact the rod member in a state where the pair of arms are closed by moving the clamp apparatus, and acquires the position information of the clamp apparatus at a time of contacting the rod member,

executes a second control to make the outer side surface of the first arm contact the rod member in a state where the pair of arms are open by moving the clamp apparatus, and acquires the position information of the clamp apparatus at the time of contacting the rod member, and

executes a third control to obtain an opening amount of the pair of arms based on the position information of the clamp apparatus acquired in the first control and the second control.

2. The wire bonding apparatus as claimed in claim 1 , wherein the control apparatus further executes a fourth control to make an outer side surface of a second arm of the pair of arms contact the rod member in the state where the pair of arms are closed by moving the clamp apparatus, and acquires the position information of the clamp apparatus at the time of contacting the rod member, and

executes a fifth control to make the outer side surface of the second arm contact the rod member in the state where the pair of arms are open by moving the clamp apparatus, and acquires the position information of the clamp apparatus at the time of contacting the rod member,

wherein in the third control, the control apparatus further uses the position information of the clamp apparatus acquired in the fourth control and the fifth control to obtain the opening amount of the pair of arms.

3. The wire bonding apparatus as claimed in claim 2 , wherein the control apparatus further executes a sixth control, which is executed prior to the first control, to make a tip part of the first arm or the second arm contact a tip part of the rod member by moving the clamp apparatus, and acquires the position information of the clamp apparatus at the time of contacting the rod member.

4. The wire bonding apparatus as claimed in claim 1 , further comprising a lifting mechanism moving the rod member in an up-down direction.

5. A method for measuring an opening amount of a clamp apparatus having a pair of arms able to open or close, the method comprising:

a first process of making an outer side surface of a first arm of the pair of arms contact a rod member in a state where the pair of arms are closed by moving the clamp apparatus, and acquiring position information of the clamp apparatus at a time of contacting the rod member,

a second process of making the outer side surface of the first arm contact the rod member in a state where the pair of arms are open by moving the clamp apparatus, and acquiring the position information of the clamp apparatus at the time of contacting the rod member, and

a third process of obtaining an opening amount of the pair of arms based on the position information of the clamp apparatus acquired in the first process and the second process.

6. The method for measuring the opening amount of the clamp apparatus as claimed in claim 5 , further comprising: a fourth process of making an outer side surface of a second arm of the pair of arms contact the rod member in the state where the pair of arms are closed by moving the clamp apparatus, and acquiring the position information of the clamp apparatus at the time of contacting the rod member, and

a fifth process of making the outer side surface of the second arm contact the rod member in the state where the pair of arms are open by moving the clamp apparatus, and acquiring the position information of the clamp apparatus at the time of contacting the rod member,

wherein in the third process, the opening amount of the pair of arms is obtained by further using the position information of the clamp apparatus acquired in the fourth process and the fifth process.

7. The method for measuring the opening amount of the clamp apparatus as claimed in claim 6 , further comprising a sixth process, which is executed prior to the first process, of making a tip part of the first arm or the second arm contact a tip part of the rod member by moving the clamp apparatus, and acquiring the position information of the clamp apparatus at the time of contacting the rod member.

8. A method for calibrating a clamp apparatus, comprising:

a process of obtaining an opening amount of a clamp apparatus according to the method for measuring the opening amount of the clamp apparatus as claimed in claim 5 ; and

a process of calibrating the clamp apparatus based on the opening amount of the clamp apparatus.

Assignments (2)
MERGER Recorded Dec 4, 2025
From: SHINKAWA LTD.
To: YAMAHA ROBOTICS CO., LTD.
Reel/Frame 073833/0572 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 18, 2021
From: TOYAMA, TOSHIHIKO
To: SHINKAWA LTD.
Reel/Frame 057825/0593 →
Cited By (1)
US 12,374,653