Patent Assignment
Reel/Frame 057825/0593
Assignment of Assignor's Interest
Recorded: 2021-10-18
Pages: 4
Assignor
TOYAMA, TOSHIHIKO
Executed: 2021-08-23
Assignee
SHINKAWA LTD.
51-1, INADAIRA 2-CHOME, MUSASHIMURAYAMA-SHI,, TOKYO, 208-8585, JAPAN
Covered Property
(1)
Wire Bonding Apparatus, Method for Measuring Opening Amount of Clamp Apparatus, and Method for Calibrating Clamp Apparatus
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.