Bonding apparatus and bonding method
A bonding apparatus and a bonding method are provided. The bonding apparatus bonds a semiconductor die to a substrate by thermocompression through an adhesive material. This bonding apparatus is provided with: a bonding tool which has a bonding surface that holds the semiconductor die through a first portion of a tape, and a pair of first tape constraining surfaces that are arranged so as to sandwich the bonding surface and constrain a second portion of the tape: tape constraining mechanisms which have a second tape constraining surface that presses the tape against the first tape constraining surfaces; and a control part which controls the movements of the bonding tool and the tape constraining mechanisms.
1. A bonding apparatus which bonds an electronic component to a substrate or another electronic component by thermocompression through an adhesive material, the bonding apparatus comprising:
a bonding tool which has a bonding surface that detachably holds the electronic component through a first portion of a sheet member with air permeability, and a pair of first sheet constraining surfaces that are arranged on both sides of the bonding surface to sandwich the bonding surface on an axial line that is parallel to the bonding surface and constrain a second portion of the sheet member;
sheet constraining parts which have a second sheet constraining surface that presses the sheet member on the first sheet constraining surfaces against the first sheet constraining surfaces and which constrain the second portion of the sheet member sandwiched between the first sheet constraining surfaces and the second sheet constraining surface; and
a bonding control part which controls operations of the bonding tool and the sheet constraining parts.
2. The bonding apparatus according to claim 1 , wherein
the bonding tool has a heating part that raises a temperature of the bonding surface, and
the bonding control part starts heating of the heating part after the sheet constraining parts constrain the second portion of the sheet member.
3. The bonding apparatus according to claim 1 , wherein
the first sheet constraining surfaces are continuous with the bonding surface through a boundary side part.
4. The bonding apparatus according to claim 1 , wherein
the sheet member has a tape shape,
the bonding apparatus further includes a sheet supply part,
wherein the sheet supply part comprises:
a first reel, to which one end of the sheet member is coupled, which lets off the sheet member and provides the sheet member; and
a second reel, to which the other end of the sheet member is coupled, which rewinds the sheet member provided from the first reel,
the bonding tool is disposed between the first reel and the second reel, and
the sheet constraining parts constrain a pair of free side parts that serve as the second portion of the sheet member.
5. The bonding apparatus according to claim 1 , wherein
the sheet member is a sheet with an individual piece shape, and
the sheet constraining parts constrain at least a pair of free side parts that serve as the second portion of the sheet member.
6. The bonding apparatus according to claim 2 , wherein
the first sheet constraining surfaces are continuous with the bonding surface through a boundary side part.
7. The bonding apparatus according to claim 2 , wherein
the sheet member has a tape shape,
the bonding apparatus further includes a sheet supply part,
wherein the sheet supply part comprises:
a first reel, to which one end of the sheet member is coupled, which lets off the sheet member and provides the sheet member; and
a second reel, to which the other end of the sheet member is coupled, which rewinds the sheet member provided from the first reel,
the bonding tool is disposed between the first reel and the second reel, and
the sheet constraining parts constrain a pair of free side parts that serve as the second portion of the sheet member.
8. The bonding apparatus according to claim 2 , wherein
the sheet member is a sheet with an individual piece shape, and
the sheet constraining parts constrain at least a pair of free side parts that serve as the second portion of the sheet member.
9. A bonding method in which an electronic component is bonded to a substrate or another electronic component by thermocompression through an adhesive material, the bonding method comprising:
preparing a bonding tool which has a bonding surface that detachably holds the electronic component through a first portion of a sheet member with air permeability, and a pair of first sheet constraining surfaces that are arranged on both sides of the bonding surface to sandwich the bonding surface on an axial line that is parallel to the bonding surface and constrain a second portion of the sheet member;
disposing the first portion of the sheet member on the bonding surface, disposing the second portion of the sheet member on the first sheet constraining surfaces, and then constraining the second portion with sheet constraining parts, the sheet constraining parts having a second sheet constraining surface that presses the sheet member on the first sheet constraining surfaces against the first sheet constraining surfaces and constraining the second portion of the sheet member sandwiched between the first sheet constraining surfaces and the second sheet constraining surface;
holding the electronic component on the bonding surface through the first portion of the sheet member; and
heating the bonding surface with a heating part that the bonding tool has and bonding the electronic component to the substrate or the other electronic component by thermocompression through an adhesive.