Patent Assignment
Reel/Frame 051137/0061
Assignment of Assignor's Interest
Recorded: 2019-11-28
Pages: 6
Assignors
WATANABE, OSAMU
Executed: 2019-11-12
HAGIWARA, YOSHIHITO
Executed: 2019-11-12
NAKAMURA, TOMONORI
Executed: 2019-10-29
Assignee
SHINKAWA LTD.
51-1, INADAIRA 2-CHOME, MUSASHIMURAYAMA-SHI,, TOKYO, 208-8585, JAPAN
Covered Property
(1)
Bonding Apparatus and Bonding Method
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.