Patent Assignment
Reel/Frame 024772/0472
Assignment of Assignor's Interest
Recorded: 2010-08-02
Pages: 4
Assignors
SEYAMA, KOHEI
Executed: 2010-08-02
KONDO, YUTAKA
Executed: 2010-08-02
KAKUTANI, OSAMU
Executed: 2010-07-30
HAYATA, SHIGERU
Executed: 2010-08-02
Assignee
SHINKAWA LTD.
51-1, INADAIRA 2-CHOME, MUSASHIMURAYAMA-SHI, TOKYO, 208-8585, JAPAN
Covered Property
(1)
Bonding Apparatus and Bonding Stage Height Adjustment Method for the Bonding Apparatus
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.