Patent Assignment
Reel/Frame 019592/0024
Assignment of Assignor's Interest
Recorded: 2007-07-13
Pages: 2
Assignor
SEYAMA, KOHEI
Executed: 2007-06-28
Assignee
KABUSHIKI KAISHA SHINKAWA
2-51-1, INADAIRA, MUSASHIMURAYAMA-SHI, TOKYO, JAPAN
Covered Property
(1)
Wire Bonding Apparatus
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.