Bonding apparatus and alignment method
A bonding apparatus includes: a clamper able to clamp a wire between a pair of arms; a horn, in which a first through hole able to hold a capillary, and a second through hole adjacent to the first through hole and penetrating the horn in an up-down direction are further formed; and a bonding stage able to carry a workpiece. An alignment method for aligning a horn and a damper of a bonding apparatus with each other includes: disposing a mirror surface to be parallel to a bonding stage; aligning a mirror image of a second through hole reflected on the mirror surface with a center of the second through hole when the mirror surface is viewed through the second through hole; and aligning the damper based on a position of the mirror image and the horn.
1. An alignment method for aligning a horn and a clamper of a bonding apparatus with each other,
the bonding apparatus comprising:
the clamper, able to clamp a wire between a pair of arms;
the horn, in which a first through hole able to hold a bonding tool, and a second through hole adjacent to the first through hole and penetrating the horn in an up-down direction are further formed; and
a bonding stage, able to carry a workpiece,
wherein the alignment method comprises:
disposing a mirror surface to be parallel to the bonding stage;
aligning a mirror image of the second through hole reflected on the mirror surface with a center of the second through hole when the mirror surface is viewed through the second through hole; and
aligning the clamper based on a position of the mirror image and the horn.
2. The alignment method according to claim 1 , wherein
aligning the mirror image comprises moving a viewpoint to a position where the mirror image is seen in the center of the second through hole;
aligning the clamper comprises moving the clamper so that, when viewed from the viewpoint, a symmetry plane of the clamper that is equidistant from each of the pair of arms overlaps a symmetry plane of the horn that bisects the first through hole and the second through hole.
3. The alignment method according to claim 2 , wherein
an opening of the second through hole has a teardrop shape having a vertex where a curvature is maximum;
aligning the clamper comprises moving the clamper so that the symmetry plane of the clamper overlaps the vertex when viewed from the viewpoint.
4. A bonding apparatus, comprising:
a clamper, able to clamp a wire between a pair of arms;
a horn, in which a first through hole able to hold a bonding tool, and a second through hole adjacent to the first through hole and penetrating the horn in an up-down direction are further formed;
a bonding stage, able to carry a workpiece; and
a control part, performing alignment between the horn and the clamper, wherein
the control part aligns a mirror image of the second through hole reflected on a mirror surface with a center of the second through hole when the mirror surface is viewed through the second through hole, the mirror surface being disposed to be parallel to the bonding stage, and
the control part aligns the clamper based on a position of the mirror image and the horn.