Method of manufacturing semiconductor device, and bonding apparatus
View Patent ↗In a first bonding step of bonding an initial ball to a pad surface, the initial ball is applied by ultrasonic vibration while in pressure contact with the pad surface and a capillary undergoes a scrubbing motion to be rotated spirally. This allows a deformation area of the initial ball to be reduced, whereby the accuracy of bonding can be improved. In a second bonding step of bonding a bonding wire to a lead surface, the capillary and the bonding wire are applied by ultrasonic vibration while in pressure contact with the lead surface and the capillary undergoes a scrubbing motion to be rotated spirally. This allows the bonding wire bonded to the lead surface to be cut reliably.
1. A method of manufacturing a semiconductor device, the method comprising:
a pressure contact step of bringing an initial ball formed at a tip end of a bonding wire that is inserted through a capillary into pressure contact with a pad surface of a bonding target placed on a bonding stage; and
a scrubbing step of spirally rotating the capillary in a direction perpendicular to a direction of pressure on the initial ball when the initial ball is in pressure contact with the pad surface;
wherein the scrubbing step comprises specifying a position where the initial ball comes into contact with the pad surface as a reference position, spirally rotating the capillary from the reference position while increasing a diameter of a spiral, and thereafter spirally rotating the capillary while reducing the diameter of the spiral to recover the reference position.
2. The method of manufacturing a semiconductor device according to claim 1 , wherein the scrubbing step comprises, when the pad surface has an extended shape, spirally rotating the capillary in a flattened manner along the direction of extension of the pad surface.
3. A method of manufacturing a semiconductor device, the method comprising:
a pressure contact step of bringing a capillary with a bonding wire inserted therethrough and the bonding wire inserted through the capillary into pressure contact with a lead surface of a bonding target placed on a bonding stage; and
a scrubbing step of spirally rotating the capillary in a direction perpendicular to a direction of pressure on the capillary when the capillary is in pressure contact with the lead surface;
wherein the scrubbing step comprises specifying a position where the capillary comes into contact with the lead surface as a reference position, spirally rotating the capillary from the reference position while increasing a diameter of a spiral, and thereafter spirally rotating the capillary while reducing the diameter of the spiral to recover the reference position.
4. The method of manufacturing a semiconductor device according to claim 3 , wherein the scrubbing step comprises, when the lead surface has an extended shape, spirally rotating the capillary in a flattened manner along a direction of extension of the lead surface.