Patent Assignment
Reel/Frame 026892/0996
Assignment of Assignor's Interest
Recorded: 2011-09-13
Pages: 2
Assignee
SHINKAWA LTD.
51-1, INADAIRA 2-CHOME, MUSASHIMURAYAMA-SHI, TOKYO, 208-8585, JAPAN
Covered Property
(1)
Method of Manufacturing Semiconductor Device, and Bonding Apparatus
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.