Wire bonding apparatus
A wire bonding apparatus is provided with: a bonding stage on which a semiconductor chip is mounted; a wire bonding unit including a capillary bonding a bonding wire to the semiconductor chip, a Z-axis drive section reciprocating the capillary, and a tool XY-stage causing the capillary and the Z-axis drive section to be moved along a two-dimensional plane intersecting a direction of reciprocation; and a base having an optical system and an optical system XY-stage causing the optical system to be moved along a two-dimensional plane intersecting a direction of reciprocation, the base having the wire bonding unit attached thereto. The wire bonding unit is attached to a first portion of the base, and the optical system XY-stage is attached to a second portion of the base which is separate from the first portion.
1. A wire bonding apparatus comprising:
a bonding stage on which a bonding target is mounted;
a wire bonding unit comprising a capillary bonding a bonding wire to the bonding target, a capillary drive section reciprocating the capillary, and a first XY-stage causing the capillary and the capillary drive section to be moved along a two-dimensional plane intersecting a direction of the reciprocation;
an imaging unit imaging the bonding target mounted on the bonding stage and comprising a second XY-stage that is independent of the first XY-stage; and
a base to which the wire bonding unit and the imaging unit are attached,
wherein the wire bonding unit is attached to a first portion of the base,
the imaging unit is attached to a second portion that is different from the first portion of the base,
in the wire bonding unit, a reference point that represents a position of the wire bonding unit is provided on a surface that can be imaged by the imaging unit,
the base comprises a sub-frame and a main frame rising from the sub-frame,
the first XY-stage is attached to the sub-frame and the second XY-stage is attached to the main frame, and
the main frame is not directly in contact with the first XY-stage.
2. The wire bonding apparatus according to claim 1 , wherein the imaging unit images the reference point and images the bonding target mounted on the bonding stage.
3. The wire bonding apparatus according to claim 2 , wherein the imaging unit obtains a first image comprising the reference point and a second image that comprises the bonding target and is different from the first image.
4. The wire bonding apparatus according to claim 3 , further comprising a control section acquiring a calibration value obtained by calculating a correlation between field-of-view coordinates of the reference point in the first image and position coordinates of the first XY-stage.
5. The wire bonding apparatus according to claim 4 , wherein the reference point is provided on an upper surface of an ultrasonic horn of the wire bonding unit.
6. The wire bonding apparatus according to claim 1 , wherein the imaging unit comprises an imaging section and a camera drive section causing the imaging section to be moved along a two-dimensional plane intersecting a direction of the reciprocation.
7. The wire bonding apparatus according to claim 5 ,
wherein the imaging unit comprises an imaging device and an optical system guiding light from the bonding target and the reference point to the imaging device,
the optical system comprises a lens and an optical splitter section disposed on an optical axis between the imaging device and the bonding target and between the imaging device and the reference point,
the lens is disposed on an optical axis between the imaging device and the optical splitter section, and
the optical splitter section is disposed on an optical axis between the bonding target and the lens and between the reference point and the lens.
8. The wire bonding apparatus according to claim 7 ,
wherein the optical splitter section comprises a half mirror and an illumination irradiating the half mirror with light, and
the optical splitter section performs switching between an optical path acquiring the first image and an optical path acquiring the second image with the light with which the half mirror is irradiated.
9. The wire bonding apparatus according to claim 2 , wherein the imaging unit comprises an imaging section and a camera drive section causing the imaging section to be moved along a two-dimensional plane intersecting a direction of the reciprocation.
10. The wire bonding apparatus according to claim 3 , wherein the imaging unit comprises an imaging section and a camera drive section causing the imaging section to be moved along a two-dimensional plane intersecting a direction of the reciprocation.
11. The wire bonding apparatus according to claim 4 , wherein the imaging unit comprises an imaging section and a camera drive section causing the imaging section to be moved along a two-dimensional plane intersecting a direction of the reciprocation.
12. The wire bonding apparatus according to claim 5 , wherein the imaging unit comprises an imaging section and a camera drive section causing the imaging section to be moved along a two-dimensional plane intersecting a direction of the reciprocation.
13. The wire bonding apparatus according to claim 6 ,
wherein the imaging unit obtains a first image comprising the reference point and a second image that comprises the bonding target and is different from the first image,
wherein the wire bonding apparatus further comprises a control section acquiring a calibration value obtained by calculating a correlation between field-of-view coordinates of the reference point in the first image and position coordinates of the first XY-stage, and
wherein the control section calculates coordinates of the reference point converted based on the calibration value in the second image, drives the camera drive section to obtain coordinates of a bonding point such that the bonding point is placed within a field-of-view for obtaining the first image, and then drives the first XY-stage to acquire a camera offset value such that the reference point is placed within a field-of-view for obtaining the second image.
14. The wire bonding apparatus according to claim 9 ,
wherein the imaging unit obtains a first image comprising the reference point and a second image that comprises the bonding target and is different from the first image,
wherein the wire bonding apparatus further comprises a control section acquiring a calibration value obtained by calculating a correlation between field-of-view coordinates of the reference point in the first image and position coordinates of the first XY-stage, and
wherein the control section calculates coordinates of the reference point converted based on the calibration value in the second image, drives the camera drive section to obtain coordinates of a bonding point such that the bonding point is placed within a field-of-view for obtaining the first image, and then drives the first XY-stage to acquire a camera offset value such that the reference point is placed within a field-of-view for obtaining the second image.
15. The wire bonding apparatus according to claim 10 ,
wherein the imaging unit obtains a first image comprising the reference point and a second image that comprises the bonding target and is different from the first image,
wherein the wire bonding apparatus further comprises a control section acquiring a calibration value obtained by calculating a correlation between field-of-view coordinates of the reference point in the first image and position coordinates of the first XY-stage, and
wherein the control section calculates coordinates of the reference point converted based on the calibration value in the second image, drives the camera drive section to obtain coordinates of a bonding point such that the bonding point is placed within a field-of-view for obtaining the first image, and then drives the first XY-stage to acquire a camera offset value such that the reference point is placed within a field-of-view for obtaining the second image.
16. The wire bonding apparatus according to claim 11 ,
wherein the imaging unit obtains a first image comprising the reference point and a second image that comprises the bonding target and is different from the first image,
wherein the wire bonding apparatus further comprises a control section acquiring a calibration value obtained by calculating a correlation between field-of-view coordinates of the reference point in the first image and position coordinates of the first XY-stage, and
wherein the control section calculates coordinates of the reference point converted based on the calibration value in the second image, drives the camera drive section to obtain coordinates of a bonding point such that the bonding point is placed within a field-of-view for obtaining the first image, and then drives the first XY-stage to acquire a camera offset value such that the reference point is placed within a field-of-view for obtaining the second image.
17. The wire bonding apparatus according to claim 12 ,
wherein the imaging unit obtains a first image comprising the reference point and a second image that comprises the bonding target and is different from the first image,
wherein the wire bonding apparatus further comprises a control section acquiring a calibration value obtained by calculating a correlation between field-of-view coordinates of the reference point in the first image and position coordinates of the first XY-stage, and
wherein the control section calculates coordinates of the reference point converted based on the calibration value in the second image, drives the camera drive section to obtain coordinates of a bonding point such that the bonding point is placed within a field-of-view for obtaining the first image, and then drives the first XY-stage to acquire a camera offset value such that the reference point is placed within a field-of-view for obtaining the second image.