Semiconductor device manufacturing method, semiconductor device, and wire bonding apparatus
View Patent ↗A semiconductor device manufacturing method includes: raising and moving a bonding tool, while paying out a wire, in a direction from a second toward a first bonding point to form in the wire a cut portion bent in a vicinity of the second bonding point; lowering and moving a tip of the bonding tool to the cut portion; lowering the bonding tool vertically to thin the cut portion; raising the bonding tool while paying out the wire; and moving the bonding tool in a direction away from the first and second bonding points and along a wire direction connecting the first and second bonding points and then cutting the wire at the cut portion to form a wire tail. This allows the length of the wire tail to be adjusted easily and efficiently to be constant.
1. A semiconductor device manufacturing method of a semiconductor device having a wire loop for connection between a first bonding point which is one side electrode and a second bonding point which is other side electrode, and the semiconductor device manufacturing method comprising:
a first bonding step of bonding a wire inserted through a bonding tool to the first bonding point;
a wire looping step of looping the wire while paying out the wire;
a second bonding step of bonding the wire to the second bonding point by touching the wire to the second bonding point;
a cut portion forming step of raising the bonding tool while paying out the wire and moving the bonding tool in a direction from the second bonding point toward the first bonding point to form the cut portion in the wire extending out of a tip of the bonding tool, the cut portion being bent in a vicinity of the second bonding point;
a bonding tool moving step of lowering the bonding tool and moving the tip of the bonding tool to the cut portion of the wire while being pressed against the wire;
a thin portion forming step of lowering the bonding tool vertically toward the second bonding point for compression to thin the cut portion of the wire on a surface of the second bonding point;
a bonding tool raising step of raising the bonding tool while paying out the wire; and
a wire tail forming step of moving the bonding tool in a direction away from the first bonding point and the second bonding point and along a wire direction connecting the first bonding point and the second bonding point and then cutting the wire at the cut portion to form a wire tail at the tip of the bonding tool.
2. The semiconductor device manufacturing method according to claim 1 , wherein
in the cut portion forming step, the bonding tool is raised to a first height;
in the bonding tool moving step, the bonding tool is lowered to a second height lower than the first height and, at the second height, the bonding tool is moved to the cut portion of the wire while the tip of the bonding tool is pressed against the wire; and
in the thin portion forming step, the bonding tool is used for compression to a third height lower than the second height.
3. The semiconductor device manufacturing method according to claim 1 , wherein
in the bonding tool moving step, the tip of the bonding tool is pressed against the wire at a point nearer the first bonding point than the second bonding point.
4. The semiconductor device manufacturing method according to claim 2 , wherein
in the thin portion forming step, the bonding tool is moved along the wire direction while being kept at the third height.