Patent Assignment
Reel/Frame 040204/0136
Assignment of Assignor's Interest
Recorded: 2016-11-03
Pages: 3
Assignor
SEKINE, NAOKI
Executed: 2016-09-02
Assignee
SHINKAWA LTD.
51-1, INADAIRA 2-CHOME, MUSASHIMURAYAMA-SHI,, TOKYO, 208-8585, JAPAN
Covered Property
(1)
Semiconductor Device Manufacturing Method, Semiconductor Device, and Wire Bonding Apparatus
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.