Electronic-component mounting apparatus
View Patent ↗Provided is a flip chip mounting apparatus for mounting chips ( 400 ) to a substrate ( 200 ), and the apparatus includes at least one sectionalized mounting stage ( 45 ) divided into a heating section ( 452 ) and a non-heating section ( 456 ), the heating section being for heating a substrate ( 200 ) fixed to a front surface of the heating section, the non-heating section not heating the substrate ( 200 ) suctioned to a front surface of the non-heating section. With this, it is possible to provide an electronic-component mounting apparatus that is simple and capable of efficiently mounting a large number of electronic components.
1. An electronic-component mounting apparatus for mounting chips to a substrate, the apparatus comprising:
a paste application block, configured to apply a non-conductive paste at positions on the substrate at which the electronic components are to be mounted;
a sectionalized mounting stage, configured to heat the substrate that has the non-conductive paste applied on, the sectionalized mounting stage is divided into a heating section and a non-heating section, the heating section being for heating a substrate fixed to a front surface of the heating section, the non-heating section not heating the substrate suctioned to a front surface of the non-heating section, only a portion of the substrate that is fixed to the heating section of the sectionalized mounting stage is heated, and the electronic components are mounted to the positions in the heated portion;
a full heating mounting stage separated from the sectionalized mounting stage, configured to heat the substrate that has been heated by the sectionalized mounting stage, the substrate is heated as a whole and is fixed to a front surface of the full heating mounting stage, and the electronic components are mounted to the positions in a remaining portion; and
a substrate transfer unit configured to transfer the substrate between the sectionalized mounting stage and the full heating mounting stage.
2. The electronic-component mounting apparatus according to claim 1 , wherein
the sectionalized mounting stage includes:
a planar base body having a planar stepped portion; and a heat insulating layer laid over the stepped portion such that a front surface of the heat insulating layer is in plane with a front surface of the base body, the substrate being fixed to the front surface of the base body and the front surface of the heat insulating layer,
the heating section is the front surface of the base body, and
the non-heating section is the front surface of the heat insulating layer.