Patent Assignment
Reel/Frame 024217/0040
Assignment of Assignor's Interest
Recorded: 2010-04-12
Pages: 2
Assignee
SHINKAWA LTD.
51-1, INADAIRA 2-CHOME, MUSASHIMURAYAMA-SHI, TOKYO, 208-8585, JAPAN
Covered Property
(1)
Semiconductor Device and Wire Bonding Method
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.