Semiconductor chip mounting device and method for manufacturing semiconductor device
Provided is a mounting device in which two or more semiconductor chips are laminated and mounted at a plurality of locations on a substrate, said mounting device including: a stage that supports the substrate; a bonding part that laminates and mounts the plurality of semiconductor chips on the substrate while heating the plurality of semiconductor chips and the substrate; and a heat insulating member that is interposed between the stage and the substrate, said heat insulating member including a first layer which is in contact with the substrate and to which heat is applied from the bonding part via the semiconductor chips and the substrate, and a second layer which is disposed closer to the stage side than the first layer, wherein the first layer has a larger heat resistance than the second layer.
1. A mounting device for laminating and mounting a plurality of semiconductor chips in a plurality of locations on a substrate, the mounting device comprising:
a stage that supports the substrate;
a bonding part comprising a mount head with a temperature variable heater, wherein the mount head is configured to laminate and mount the plurality of semiconductor chips on the substrate while heating the plurality of semiconductor chips and the substrate; and
a heat insulating member that is interposed between the stage and the substrate and has a first layer which is adjacent to the substrate and a second layer which is disposed closer to the stage side than the first layer,
wherein the first layer has a greater heat resistance than the second layer.
2. The mounting device according to claim 1 ,
wherein the second layer has a higher rigidity than the first layer.
3. The mounting device according to claim 1 ,
wherein the first layer has a greater heat resistance along a surface direction than the second layer.
4. The mounting device according to claim 1 ,
wherein the first layer comprises an organic substance or a workpiece in which a groove is formed on a surface on the substrate side or a plurality of pores are formed within the layer, and
wherein the second layer comprises a non-metal inorganic material.
5. The mounting device according to claim 4 ,
wherein the first layer is a workpiece in which a latticed groove is formed on the surface on the substrate side at a same pitch as a disposition pitch of a chip laminate in which the plurality of semiconductor chips are laminated.
6. A method for manufacturing a semiconductor device comprising:
a temporary crimping step of forming a plurality of temporary laminates in which a plurality of semiconductor chips are laminated while being subjected to a temporary crimping by a bonding part on a substrate disposed on a heat insulating member, wherein the heat insulating member is interposed between the substrate and a stage supporting the substrate; and
a permanent crimping step of repeating a process twice or more, the process comprising: collectively performing permanent crimping of the plurality of temporary laminates by heating the plurality of temporary laminates while the bonding part crimps an upper surface of at least one of the plurality of temporary laminates,
wherein the heat insulating member has a first layer which is in contact with the substrate and to which heat is applied from the bonding part via the chips and the substrate, and a second layer which is disposed closer to the stage side than the first layer, and
wherein the first layer has greater heat resistance than the second layer.