Assignment of Assignor's Interest

Recorded: 2007-10-01 Pages: 2

Assignors

NISHIURA, SHINICHI

Executed: 2007-08-13

MIYAMO, FUMIO

Executed: 2007-08-13

HORINO, MASAYUKI

Executed: 2007-08-13

Assignee

KABUSHIKI KAISHA SHINKAWA

2-51-1, INADAIRA, MUSASHIMURAYAMA-SHI, TOKYO, JAPAN

Covered Property (1)

Bonding Apparatus, Ball Forming Device in Said Bonding Apparatus, and Ball Forming Method Using Said Bonding Apparatus

Patent: 7,644,852 →

Application: 11/824,863 →

Publication: US 2008/0035709

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.