Bonding apparatus

1. A bonding apparatus comprising:

a bonding stage on which either a rectangular substrate or a circular substrate is installable;

a first transport mechanism which transports the rectangular substrate from a first carry-in unit to the bonding stage and from the bonding stage to a first carry-out unit; and

a second transport mechanism which transports the circular substrate from a second carry-in unit to the bonding stage and from the bonding stage to a second carry-out unit,

wherein a first transport path determined by the first transport mechanism and a second transport path determined by the second transport mechanism partially overlap.

2. The bonding apparatus according to claim 1 , wherein the bonding apparatus is switchable between a first state in which the first transport mechanism is enabled and the second transport mechanism is disabled, and a second state in which the first transport mechanism is disabled and the second transport mechanism is enabled.

3. The bonding apparatus according to claim 2 , wherein the first transport mechanism has a planar transport unit which defines a planar path on which the rectangular substrate is transported,

the second transport mechanism has an arm transport unit which transports the circular substrate, and

the first state and the second state are switched, by movement of the planar transport unit.

4. The bonding apparatus according to claim 3 , wherein the planar transport unit is able to swing and move around an axis extending in a longitudinal direction of the planar transport unit,

the arm transport unit is able to move upward and downward,

in the first state, the arm transport unit moves downward, and the planar transport unit is located above the arm transport unit, and

in the second state, the arm transport unit moves upward, and the planar transport unit is located on a lateral side of the arm transport unit.

5. The bonding apparatus according to claim 4 , wherein the planar transport unit is a carry-out planar transport unit which transports the rectangular substrate from the bonding stage to the first carry-out unit, and

the arm transport unit is disposed in the middle from the bonding stage to the first carry-out unit.

6. The bonding apparatus according to claim 5 , wherein the first carry-in unit and the first carry-out unit are arranged on the left and right sides toward a front surface of the bonding apparatus, and the first transport path extends in a left-right direction, and

the second carry-in unit and the second carry-out unit are arranged on a front side toward the front surface of the bonding apparatus, and the second transport path is bent once or more.

7. The bonding apparatus according to claim 1 , wherein the circular substrate is a wafer.

8. The bonding apparatus according to claim 1 , wherein the bonding stage comprises:

a base portion, and

an adapter which is freely attachable to and detachable from the base portion, and is alternatively selected and mounted on the base portion, depending on the type of a substrate to be handled.

9. The bonding apparatus according to claim 2 , further comprising:

a substrate holding unit which holds a lower surface of the circular substrate when the circular substrate is transported to the bonding stage in the second state,

wherein the substrate holding unit retreats to a position at which the substrate holding unit does not interfere with the first transport mechanism in the first state.