Patent Assignment
Reel/Frame 024010/0768
Assignment of Assignor's Interest
Recorded: 2010-02-25
Pages: 3
Assignors
MII, TATSUNARI
Executed: 2010-02-08
TEI, SHINSUKE
Executed: 2010-02-12
KIUCHI, HAYATO
Executed: 2010-02-10
Assignee
KABUSHIKI KAISHA SHINKAWA
2-51-1, INADAIRA, MUSASHIMURAYAMA-SHI, TOKYO, JAPAN
Covered Property
(1)
Wire Bonding Method and Semiconductor Device
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.