Wire bonding apparatus, circuit for wire bonding apparatus, and method for manufacturing semiconductor device
The present invention comprises: a spool ( 10 ); a clamper ( 22 ); a torch electrode ( 31 ); a high-voltage power source circuit ( 30 ); a non-bonding detection circuit ( 40 ); a first changeover switch ( 50 ) switching a connection between the spool ( 10 ) and the high-voltage power source circuit ( 30 ) or the non-bonding detection circuit ( 40 ); and a relay ( 53 ) turning on/off a connection between the clamper ( 22 ) and a spool side of the first changeover switch ( 50 ), and comprises a control part ( 60 ) that sets the first changeover switch ( 50 ) to the high-voltage power source circuit side and turns off the relay ( 53 ) to generate electric discharge, and that sets the first changeover switch ( 50 ) to the non-bonding detection circuit side and turns on the relay ( 53 ) to perform non-bonding detection. Due to this configuration, electric corrosion of a wire clamper can be suppressed and non-bonding detection can be carried out with a simple configuration.
1. A wire bonding apparatus comprising:
a spool;
a clamper that grips a wire extended from the spool;
a torch electrode that forms a free air ball at a front end of the wire by electrical discharges;
a high-voltage power supply circuit that supplies power to the torch electrode;
a non-bonding detection circuit that performs non-bonding detection between the wire and a device or the wire and a substrate;
a first changeover switch that switches a connection between the spool and the high-voltage power supply circuit or the spool and the non-bonding detection circuit;
a relay that turns on/off a connection between the clamper and the spool side of the first changeover switch; and
a control part that sets the first changeover switch to the high-voltage power supply circuit side and turns off the relay to generate the electrical discharges, and sets the first changeover switch to the non-bonding detection circuit side and turns on the relay to perform the non-bonding detection.
2. The wire bonding apparatus according to claim 1 , comprising:
a second changeover switch disposed between the spool side of the first changeover switch and the spool, and switching a connection between the spool side of the first changeover switch and a grounding wire, wherein
the control part performs a conduction confirmation of the spool by setting the first changeover switch to the non-bonding detection circuit side, turning on the relay, and setting the second changeover switch to the grounding wire side.
3. The wire bonding apparatus according to claim 2 , comprising:
a wire guide disposed between the spool and the clamper and including a through hole with which at least a portion of the wire is in contact; and
a connection wire connecting the wire guide and the spool side of the first changeover switch.
4. A circuit for a wire bonding apparatus comprising:
a high-voltage power supply circuit that supplies power to a torch electrode forming a free air ball at a front end of a wire by electrical discharges;
a non-bonding detection circuit that performs non-bonding detection between the wire and a device or the wire and a substrate;
a first changeover switch that switches a connection between a spool from which the wire extends and the high-voltage power supply circuit or the spool and the non-bonding detection circuit;
a relay that turns on/off a connection between a clamper gripping the wire extended from the spool and the spool side of the first changeover switch; and
a control part that sets the first changeover switch to the high-voltage power supply circuit side and turns off the relay to generate the electrical discharges, and sets the first changeover switch to the non-bonding detection circuit side and turns on the relay to perform the non-bonding detection.
5. A method of manufacturing a semiconductor device comprising processes as follows:
preparing a wire bonding apparatus including: a spool; a clamper that grips a wire extended from the spool; a torch electrode that forms a free air ball at a front end of the wire by electrical discharges; a high-voltage power supply circuit that supplies power to the torch electrode; a non-bonding detection circuit that performs non-bonding detection between the wire and a device or the wire and a substrate; a first changeover switch that switches a connection between the spool and the high-voltage power supply circuit or the spool and the non-bonding detection circuit; and a relay that turns on/off a connection between the clamper and the spool side of the first changeover switch;
forming the free air ball by setting the first changeover switch to the high-voltage power supply circuit side and turning off the relay, and causing the high-voltage power supply circuit to supply power to the torch electrode;
bonding the wire in which the free air ball is formed to a device or a substrate; and
performing the non-bonding detection between the wire and the device or the wire and the substrate by setting the first changeover switch to the non-bonding detection circuit side and turning on the relay.