Patent Assignment
Reel/Frame 048618/0611
Assignment of Assignor's Interest
Recorded: 2019-03-18
Pages: 4
Assignors
ABE, JUNICHI
Executed: 2019-01-28
UEDA, HISASHI
Executed: 2019-01-28
KONDO, YUTAKA
Executed: 2019-01-28
Assignee
SHINKAWA LTD.
51-1 INADAIRA 2-CHOME, MUSASHIMURAYAMA-SHI,, TOKYO, 208-8585, JAPAN
Covered Property
(1)
Wire Bonding Apparatus, Circuit for Wire Bonding Apparatus, and Method for Manufacturing Semiconductor Device
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.