IP Library › Assignment 027372/0925
Patent Assignment
Reel/Frame 027372/0925

Corrective Assignment to Correct the 2ND and 3RD Inventors Doc Date Previously Recorded on Reel 024018 Frame 0736. Assignor(S) Hereby Confirms the (See Document for Details).

Recorded: 2011-12-13 Pages: 5
Assignors
MII, TATSUNARI
Executed: 2010-02-08
TEI, SHINSUKE
Executed: 2010-02-12
KIUCHI, HAYATO
Executed: 2010-02-10
Assignee
KABUSHIKI KAISHA SHINKAWA
2-51-1, INADAIRA, MUSASHIMURAYAMA-SHI, TOKYO, 208-8585, JAPAN
Covered Property (1)
Wire Bonding Method and Semiconductor Device
Patent: 8,143,155 →
Application: 12/589,481 →
Publication: US 2010/0207280
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 1, 2010
From: MII, TATSUNARI; TEI, SHINSUKE; KIUCHI, HAYATO
To: KABUSHIKI KAISHA SHINKAWA
Reel/Frame 024018/0736 →
Merger Dec 4, 2025
From: SHINKAWA LTD.
To: YAMAHA ROBOTICS CO., LTD.
Reel/Frame 073833/0572 →