Patent Assignment
Reel/Frame 024018/0736
Assignment of Assignor's Interest
Recorded: 2010-03-01
Pages: 3
Assignors
MII, TATSUNARI
Executed: 2010-02-08
TEI, SHINSUKE
Executed: 2010-02-10
KIUCHI, HAYATO
Executed: 2010-02-12
Assignee
KABUSHIKI KAISHA SHINKAWA
2-51-1, INADAIRA, MUSASHIMURAYAMA-SHI, TOKYO, JAPAN
Covered Property
(1)
Wire Bonding Method and Semiconductor Device
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the 2ND and 3RD Inventors Doc Date Previously Recorded on Reel 024018 Frame 0736. Assignor(S) Hereby Confirms the (See Document for Details).
Dec 13, 2011
From: MII, TATSUNARI; TEI, SHINSUKE; KIUCHI, HAYATO
To: KABUSHIKI KAISHA SHINKAWA
Reel/Frame 027372/0925 →
Merger
Dec 4, 2025
From: SHINKAWA LTD.
To: YAMAHA ROBOTICS CO., LTD.
Reel/Frame 073833/0572 →