Electronic component mounting apparatus

1. An electronic component mounting apparatus for mounting an electronic component onto a substrate, the apparatus comprising:

a mounting tool configured to hold the electronic component at a tip end of the tool;

a base member to which a guide rail for guiding up-and-down movement in a vertical direction of the mounting tool is attached, and a position of which in a horizontal direction and in the vertical direction is fixed;

a second pressurizing mechanism configured to be movable in the vertical direction and provided between the base member and the mounting tool, the second pressurizing mechanism having a supporting mechanism configured by coupling a moving body assembled to the guide rail with a motor folder that holds a drive unit of the second pressurizing mechanism, the second pressurizing mechanism being configured to move the mounting tool in the vertical direction with respect to the supporting mechanism to apply a second load to the electronic component;

a first pressurizing mechanism having a transmission shaft attached to the base member, and configured to move the mounting tool in the vertical direction and to transmit a first load to the electronic component, the transmission shaft applying the first load to the electronic component by directly driving the motor folder vertically downward;

a sliding shaft configured to transmit a load to the electronic component via the mounting tool, the sliding shaft being provided between the second pressurizing mechanism and the mounting tool, the sliding shaft having a lower end to which the mounting tool is attached, the sliding shaft extending along the vertical direction;

a load sensor located between the sliding shaft and the second pressurizing mechanism, and directly or indirectly connected to the mounting tool; and

a control unit configured to control driving of the first pressurizing mechanism and the second pressurizing mechanism, the control unit controlling so as to, when the first load is applied by the first pressurizing mechanism, drive the second pressurizing mechanism to a vertically upward direction previously and bring the load sensor into contact with the supporting mechanism to produce precompression; and

a leaf spring as a guiding mechanism configured to restrict displacement in the horizontal direction and to permit displacement in the vertical direction of the mounting tool with respect to the moving body, the leaf spring having one end directly coupled to the sliding shaft near the mounting tool and the other end directly coupled to the moving body of the supporting mechanism, wherein

the leaf spring has a cantilever structure including an upper leaf spring and a lower leaf spring, and

the control unit moves the second pressurizing mechanism in the vertical direction within a range in which the leaf spring strokes substantially in the vertical direction.

2. The electronic component mounting apparatus according to claim 1 , wherein

the control unit controls so that, when the first load is applied to the electronic component by the first pressurizing mechanism, the second load is applied to the electronic component by the second pressurizing mechanism to perform temporary mounting of the electronic component, and then the first load is applied by the first pressurizing mechanism.