IP Library › Assignment 020558/0787
Patent Assignment
Reel/Frame 020558/0787

Assignment of Assignor's Interest

Recorded: 2008-02-14 Pages: 2
Assignors
MII, TATSUNARI
Executed: 2008-02-04
TOYAMA, TOSHIHIKO
Executed: 2008-02-06
YOSHINO, HIROAKI
Executed: 2008-02-07
Assignee
KABUSHIKI KAISHA SHINKAWA
2-51-1, INADAIRA, MUSASHIMURAYAMA-SHI, TOKYO, JAPAN
Covered Property (1)
Semiconductor Device and Wire Bonding Method
Patent: 7,808,116 →
Application: 12/070,000 →
Publication: US 2008/0197510
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 23, 2009
From: OLDHAM, JOSHUA ROBERT
To: WHITE, ELIZABETH A.
Reel/Frame 022150/0719 →
Merger Dec 4, 2025
From: SHINKAWA LTD.
To: YAMAHA ROBOTICS CO., LTD.
Reel/Frame 073833/0572 →