Patent Assignment
Reel/Frame 024295/0846
Assignment of Assignor's Interest
Recorded: 2010-04-27
Pages: 2
Assignee
SHINKAWA LTD.
51-1, INADAIRA 2-CHOME,, MUSASHIMURAYAMA-SHI, TOKYO, 208-8585, JAPAN
Covered Property
(1)
Die Pickup Apparatus for Picking Up Semiconductor Dies and Methods for Picking Up Semiconductor Dies
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.