IP Library Assignment 025500/0388
Patent Assignment
Reel/Frame 025500/0388

Assignment of Assignor's Interest

Recorded: 2010-12-14 Pages: 2
Assignors
SUGAWARA, KENJI
Executed: 2010-11-29
CHEN, YONG
Executed: 2010-11-19
Assignee
SHINKAWA LTD
51-1, INADAIRA 2-CHOME,, MUSASHIMURAYAMA-SHI, TOKYO, 208-8585, JAPAN
Covered Property (1)
Pressure-Bonded Ball Diameter Detecting Apparatus and Pressure-Bonded Ball Diameter Detecting Method
Patent: 8,149,276 →
Application: 12/963,874 →
Publication: US 2011/0128369
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Dec 4, 2025
From: SHINKAWA LTD.
To: YAMAHA ROBOTICS CO., LTD.
Reel/Frame 073833/0572 →