Wire bonding apparatus
The present invention includes: an ultrasonic horn ( 14 ) to which two ultrasonic vibrations can be input to excite a capillary ( 15 ) mounted to a front end with different frequencies in a Y-direction and an X-direction; and a control unit ( 50 ) which adjusts the respective magnitude of the two ultrasonic vibrations. The Y-direction is a direction in which the ultrasonic horn ( 14 ) extends. The control unit ( 50 ) adjusts the respective magnitude of the two ultrasonic vibrations to adjust a ratio (ΔY/ΔX) of amplitude of the capillary ( 15 ) in the Y-direction and the X-direction. Thus, degradation in the quality of the joining between wires and leads is suppressed.
1. A wire bonding apparatus, comprising:
an ultrasonic vibrator capable of vibrating at two different frequencies in a Y-direction;
an ultrasonic horn which resonates in the Y-direction by using ultrasonic vibration at a first frequency input by the ultrasonic vibrator and torsionally resonates around Y axis by using ultrasonic vibration at a second frequency, that is different from the first frequency, input by the ultrasonic vibrator to excite a bonding tool mounted to a front end with different frequencies in the Y-direction and an X-direction perpendicular to the Y-direction;
a driver, which comprises a first circuit supplying power of the first frequency to the ultrasonic vibrator and a second circuit supplying power of the second frequency to the ultrasonic vibrator;
a control unit which is connected to the driver and adjusts a respective magnitude of the two ultrasonic vibrations; and
an imaging device which captures an image of an electrode, wherein
the Y-direction is a direction in which the ultrasonic horn extends, and
the control unit processes the image of the electrode captured by the imaging device, calculates an angle of an extending direction of the electrode with respect to the Y-direction, and
the control unit adjusts respective output of the first circuit and the second circuit according to the calculated angle to make an extending direction of a diagonal line of a vibration range of the bonding tool to be the extending direction of the electrode.
2. The wire bonding apparatus according to claim 1 , wherein
the bonding tool connects a wire to the electrode, which is a band-shaped electrode and is disposed inclined with respect to the Y-direction.
3. The wire bonding apparatus according to claim 2 , wherein
the control unit reduces the output of the first circuit in a way that the larger the calculated angle, the smaller the ratio of the amplitude of the bonding tool in the Y-direction with respect to the amplitude of the bonding tool in the X-direction.
4. The wire bonding apparatus according to claim 2 , wherein
the control unit adjusts a ratio of the respective output of the first circuit and the second circuit so that the ratio of the amplitude of the bonding tool in the Y-direction and the X-direction becomes a ratio of the extending direction of the electrode in the Y-direction and the X-direction.
5. The wire bonding apparatus according to claim 3 , wherein
the control unit processes the image of the electrode captured by the imaging device to calculate a width of the electrode in a direction perpendicular to the extending direction of the electrode, and
adjusts the respective output of the first circuit and the second circuit so that the amplitude of the bonding tool in the direction perpendicular to the extending direction of the electrode does not exceed the calculated width of the electrode.
6. The wire bonding apparatus according to claim 4 , wherein
the control unit processes the image of the electrode captured by the imaging device to calculate a width of the electrode in a direction perpendicular to the extending direction of the electrode, and
adjusts the respective output of the first circuit and the second circuit so that the amplitude of the bonding tool in the direction perpendicular to the extending direction of the electrode does not exceed the calculated width of the electrode.
7. The wire bonding apparatus according to claim 1 , wherein the ultrasonic horn comprises:
a vibration amplification unit, which amplifies the ultrasonic vibration in the Y-direction input from the ultrasonic vibrator and transmits the amplified ultrasonic vibration to the front end, and
a vibration conversion unit, which converts the ultrasonic vibration in the Y-direction to torsional vibration of the ultrasonic horn.
8. The wire bonding apparatus according to claim 7 , wherein
the vibration amplification unit has a polygonal shape in a plan view, and the vibration conversion unit is a slit which is disposed obliquely with respect to the Y-direction.
9. The wire bonding apparatus according to claim 4 , wherein the ultrasonic horn comprises:
a vibration amplification unit, which amplifies the ultrasonic vibration in the Y-direction input from the ultrasonic vibrator and transmits the amplified ultrasonic vibration to the front end, and
a vibration conversion unit, which converts the ultrasonic vibration in the Y-direction to torsional vibration of the ultrasonic horn.
10. The wire bonding apparatus according to claim 5 , wherein the ultrasonic horn comprises:
a vibration amplification unit, which amplifies the ultrasonic vibration in the Y-direction input from the ultrasonic vibrator and transmits the amplified ultrasonic vibration to the front end, and
a vibration conversion unit, which converts the ultrasonic vibration in the Y-direction to torsional vibration of the ultrasonic horn.
11. The wire bonding apparatus according to claim 6 , wherein the ultrasonic horn comprises:
a vibration amplification unit, which amplifies the ultrasonic vibration in the Y-direction input from the ultrasonic vibrator and transmits the amplified ultrasonic vibration to the front end, and
a vibration conversion unit, which converts the ultrasonic vibration in the Y-direction to torsional vibration of the ultrasonic horn.