Mounting device
A semiconductor mounting device for mounting chip components on a substrate, wherein the device is reduced in size. A semiconductor mounting device 10 comprises: a temporary placement stage 12 on which are loaded a plurality of chip components 30 a, 30 b, 30 c ; a conveyance head 14 that conveys the chip components 30 a, 30 b, 30 c to the temporary placement stage 12 , and also loads each of the chip components 30 a, 30 b, 30 c on the temporary placement stage 12 so that the relative positions of the plurality of chip components 30 a, 30 b, 30 c reach predetermined positions; a mounting stage 16 that secures a substrate 36 by suction; and a mounting head 18 that suctions the plurality of chip components 30 a, 30 b, 30 c loaded on the temporary placement stage 12 , and pressurizes while keeping the relative positions at prescribed positions on the substrate 36 that is secured by suction to the mounting stage 16.
1. A mounting device mounting a chip component on a substrate, the mounting device comprising:
a temporary placement stage on which a plurality of the chip components are loaded;
a conveyance head conveying the chip component to the temporary placement stage, and loading each chip component on the temporary placement stage so that relative positions of the plurality of chip components reach predetermined positions;
a mounting stage securing the substrate by suction; and
a mounting head suctioning a chip component set which is the plurality of chip components loaded on the temporary placement stage, and pressurizing and securing while keeping the relative positions at the predetermined positions on the substrate that is secured by suction to the mounting stage,
wherein while the mounting head is securing the chip component set to the substrate, the conveyance head loads a plurality of the chip components constituting a chip component set which is scheduled to be secured to the substrate next on the temporary placement stage, and
a number of the chip components constituting the chip component set is determined so that after the mounting head secures the chip component set to the substrate, while the mounting head moves toward the temporary placement stage in order to suction the chip component set scheduled to be secured next, loading of the chip component set on the temporary placement stage performed by the conveyance head is completed.
2. The mounting device according to claim 1 , wherein the temporary placement stage has an upper surface vacuum-suctioning the chip component,
the upper surface is formed of a first porous member, and
the first porous member comprises suction holes at an interval shorter than a length of each side of the chip component loaded on the upper surface.
3. The mounting device according to claim 2 , wherein the mounting head has a suction surface vacuum-suctioning the plurality of chip components,
the suction surface is formed of a second porous member, and
the second porous member comprises suction holes at an interval shorter than the length of each side of each chip component suctioned to the suction surface.
4. The mounting device according to claim 1 , wherein the mounting head has a suction surface vacuum-suctioning the plurality of chip components,
the suction surface is formed of a second porous member, and
the second porous member comprises suction holes at an interval shorter than the length of each side of each chip component suctioned to the suction surface.