Electronic component mounting device
An electronic component mounting device ( 100 ) bonds a semiconductor die ( 150 ) to a substrate by thermocompression bonding, and seals, using an insulating resin, a gap between the semiconductor die ( 150 ) and the substrate. The electronic component mounting device is provided with: a film cutting mechanism ( 200 ) for cutting a long film ( 210 ) into cut pieces; and a mounting tool ( 110 ), which vacuum-sucks the semiconductor die ( 150 ), and bonds the die to the substrate by thermocompression bonding. Consequently, in the electronic component mounting device ( 100 ) that moves a mounting head in the horizontal direction, adhesion of the insulating resin to the mounting tool can be suppressed.
1. An electronic component mounting device that thermocompression-bonds an electronic component to a substrate or another electronic component and seals a gap between the electronic component and the substrate or a gap between the electronic component and the other electronic component using an insulating resin, the electronic component mounting device comprising:
a film cutting mechanism which makes an end of a long film left in the width direction to cut out a sliced film; and
a mounting tool which has a compression bonding portion and a holding portion, wherein the compression bonding portion vacuum-suctions the electronic component through the sliced film via a first adsorption path and thermocompression-bonds the electronic component to the substrate or the other electronic component through the sliced film, the holding portion suctions and holds the sliced film via a second adsorption path formed on the outside of the compression bonding portion, and the compression bonding portion protrudes from the holding portion,
wherein the film cutting mechanism includes:
a base body part;
a film feeding roll, disposed on a side of the base body part, wherein the long film is wound around the film feeding roll; and
a film take-up roll, disposed on the other side of the base body part, wherein the long film is fixed to the film take-up roll,
wherein the film feeding roll supplies the long film and the film take-up roll recovers the long film from which the sliced film is cut,
wherein the sliced film is separated from the end of the long film left in the width direction, a surface of the compression bonding portion is connected to a lower surface of the holding portion via a side surface of the compression bonding portion, and the sliced film is adsorbed onto the lower side of the mounting tool in a manner of covering the surface and the side surface of the compression bonding portion and the lower surface of the holding portion, wherein the lower surface of the holding portion is a flat surface relative to the surface of the compression bonding portion.
2. The electronic component mounting device according to claim 1 , further comprising:
a film recovery mechanism which receives the sliced film from a surface of the mounting tool.
3. The electronic component mounting device according to claim 1 , wherein
the base body part of the film cutting mechanism has a hole having a size larger than a planar shape of the compression bonding portion;
the film cutting mechanism further includes:
a clamper which has a hole having the same shape as the base body part and has the long film inserted between the clamper and the base body part, and
a punch being inserted into and removed from the hole of the base body part and the hole of the clamper and cutting out the sliced film from the long film; and
a surface of the punch in contact with the long film is a plane for transferring the sliced film on a surface of the mounting tool.
4. The electronic component mounting device according to claim 2 , wherein the film recovery mechanism includes a flat plate-shaped stage and an adsorption tape which moves along a surface of the stage to sequentially receive the sliced film from the surface of the mounting tool.