IP Library Assignment 058475/0370
Patent Assignment
Reel/Frame 058475/0370

Assignment of Assignor's Interest

Recorded: 2021-12-23 Pages: 4
Assignor
SEYAMA, KOHEI
Executed: 2021-12-09
Assignee
SHINKAWA LTD.
51-1, INADAIRA 2-CHOME, MUSASHIMURAYAMA-SHI,, TOKYO, 208-8585, JAPAN
Covered Property (1)
Electronic Component Mounting Device
Application: 16/496,456 →
Publication: US 2020/0373275
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Dec 4, 2025
From: SHINKAWA LTD.
To: YAMAHA ROBOTICS CO., LTD.
Reel/Frame 073833/0572 →