Mounting apparatus and mounting system
A mounting apparatus for stacking and mounting two or more semiconductor chips at a plurality of locations on a substrate includes: a first mounting head for forming, at a plurality of locations on the substrate, temporarily stacked bodies in which two or more semiconductor chips are stacked in a temporarily press-attached state; and a second mounting head for forming chip stacked bodies by sequentially finally press-attaching the temporarily stacked bodies formed at the plurality of locations. The second mounting head includes: a press-attaching tool for heating and pressing an upper surface of a target temporarily stacked body to thereby finally press-attach the two or more semiconductor chips configuring the temporarily stacked body altogether; and one or more heat-dissipation tools having a heat-dissipating body which, by coming into contact with an upper surface of another stacked body positioned around the target temporarily stacked body, dissipates heat from the another stacked body.
1. A mounting device mounting apparatus for stacking and mounting two or more semiconductor chips at a plurality of locations on a substrate, the mounting apparatus comprising:
a temporary press-attachment head for forming, at a plurality of locations on the substrate, temporarily stacked bodies in which two or more semiconductor chips are stacked in a temporarily press-attached state; and
a final press-attachment head for forming chip stacked bodies by sequentially finally press-attaching the temporarily stacked bodies formed at the plurality of locations,
wherein the final press-attachment head comprises
a press-attaching tool for heating and pressing an upper surface of a target temporarily stacked body to thereby finally press-attach the two or more semiconductor chips configuring the temporarily stacked body altogether, and
at least three heat-dissipation tools having a heat-dissipating body which, by coming into contact with an upper surface of another stacked body positioned around the target temporarily stacked body, dissipates heat from the another stacked body,
wherein the press-attaching tool and the at least three heat-dissipation tools are arranged with the press-attaching tool as a center and the at least three heat-dissipation tools surrounding the press-attaching tool.
2. The mounting apparatus according to claim 1 ,
wherein the final press-attachment head has a base to which the press-attaching tool and the heat-dissipation tools are attached, and
wherein the base is lifted and lowered, and thereby the press-attaching tool and the heat-dissipation tools are lifted and lowered in connection with the base.
3. The mounting apparatus according to claim 2 ,
wherein the heat-dissipation tools are attached to the base via an elastic body and is capable of being lifted and lowered with respect to the base within a range of an amount of elastic deformation of the elastic body.
4. The mounting apparatus according to claim 3 ,
wherein a height of a bottom surface of the heat-dissipation tools in a no-load state is lower than a height of a bottom surface of the press-attaching tool.
5. The mounting apparatus according to claim 1 ,
wherein the heat-dissipating body is cooled by a refrigerant.
6. The mounting apparatus according to claim 1 ,
wherein the final press-attachment head has one press-attaching tool and eight heat-dissipation tools, and
wherein the press-attaching tool and the heat-dissipation tools are arranged in three rows and three columns with the press-attaching tool as a center.
7. The mounting apparatus according to claim 5 ,
wherein the final press-attachment head has one press-attaching tool and eight heat-dissipation tools, and
wherein the press-attaching tool and the heat-dissipation tools are arranged in three rows and three columns with the press-attaching tool as a center.
8. A mounting system for stacking and mounting two or more semiconductor chips at a plurality of locations on a substrate, the mounting system comprising:
a temporary press-attaching device for forming, at a plurality of locations on the substrate, temporarily stacked bodies in which two or more semiconductor chips are stacked in a temporarily press-attached state; and
a final press-attaching device for forming chip stacked bodies by sequentially finally press-attaching the temporarily stacked bodies formed at the plurality of locations by the temporary press-attaching device,
wherein the final press-attaching device comprises
a press-attaching tool for heating and pressing an upper surface of a target temporarily stacked body to thereby finally press-attach the two or more semiconductor chips configuring the temporarily stacked body altogether; and
at least three heat-dissipation tools having a heat-dissipating body which, by coming into contact with an upper surface of another stacked body positioned around the target temporarily stacked body, dissipates heat from the another stacked body,
wherein the press-attaching tool and the at least three heat-dissipation tools are arranged with the press-attaching tool as a center and the at least three heat-dissipation tools surrounding the press-attaching tool.