Patent Assignment
Reel/Frame 017845/0261
Assignment of Assignor's Interest
Recorded: 2006-06-26
Pages: 5
Assignors
SIEPE, DIRK
Executed: 2006-04-12
BAYERER, REINHOLD
Executed: 2006-04-12
LENNIGER, ANDREAS
Executed: 2006-04-12
Assignee
INFINEON TECHNOLOGIES AG
ST.-MARTIN-STR. 53, MUENCHEN, 81669, GERMANY
Covered Property
(1)
Method, Device and System for Bonding a Semiconductor Element