IP Library › Assignment 017852/0326
Patent Assignment
Reel/Frame 017852/0326

Assignment of Assignor's Interest

Recorded: 2006-04-24 Pages: 3
Assignors
TSAI, FANG WEN
Executed: 2006-04-19
CHEN, I-I
Executed: 2006-04-19
WU, ZHEN-CHENG
Executed: 2006-04-19
LIN, CHIH-LUNG
Executed: 2006-04-19
BAO, TIEN-I
Executed: 2006-04-19
JENG, SHWANG-MING
Executed: 2006-04-19
YU, CHEN-HUA
Executed: 2006-04-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, ROC 300-77, TAIWAN
Covered Property (1)
Method for Forming Dielectric Film to Improve Adhesion of Low-K Film
Patent: 7,465,676 →
Application: 11/409,658 →
Publication: US 2007/0249159
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 30, 2023
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
To: ADVANCED MANUFACTURING INNOVATIONS INC.
Reel/Frame 064180/0278 →