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Patent Assignment
Reel/Frame 017861/0266

Assignment of Assignor's Interest

Recorded: 2006-05-02 Pages: 3
Assignors
PARK, JE-MIN
Executed: 2006-04-04
KIM, BYUNG-YOON
Executed: 2006-04-04
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Contact Structure Having Silicide Layers, Semiconductor Device Employing the Same, and Methods of Fabricating the Contact Structure and Semiconductor Device
Patent: 7,446,043 →
Application: 11/416,328 →
Publication: US 2007/0059931