Patent Assignment
Reel/Frame 017870/0085
Assignment of Assignor's Interest
Recorded: 2006-06-27
Pages: 2
Assignor
NEOMAX CO., LTD.
Executed: 2006-06-15
Assignee
NEOMAX MATERIALS CO., LTD.
2-19-1, MINAMISUITA, SUITA-SHI, OSAKA, 564-0043, JAPAN
Covered Property
(1)
Solder Bump Transfer Sheet, Method for Producing the Same, and Methods for Fabricating Semiconductor Device and Printed Board
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.