Patent Assignment
Reel/Frame 017877/0193
Assignment of Assignor's Interest
Recorded: 2006-05-12
Pages: 3
Assignee
SEIKO EPSON CORPORATION
4-1 NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO, 163-0811, JAPAN
Covered Property
(1)
Semiconductor Device, Manufacturing Method for Semiconductor Device, Electronic Component, Circuit Substrate, and Electronic Apparatus
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.