Patent Assignment
Reel/Frame 017895/0489
Assignment of Assignor's Interest
Recorded: 2006-05-12
Pages: 3
Assignor
KIKUSHIMA, KIMIHIRO
Executed: 2006-04-25
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property
(1)
SIP type package containing analog semiconductor chip and digital semiconductor chip stacked in order, and method for manufacturing the same
Application:
11/432,528 →
Publication:
US 2006/0261471
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.